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EMC3030 1W 3V Smd Led

●Viewing angle:120 deg                        
●The materials of the LED dice is InGaN          
●3.20mm×3.00mm×0.6mm                      
●RoHS compliant lead-free soldering compatible

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 Feature

 

Viewing angle:120 deg                        

The materials of the LED dice is InGaN          

3.20mm×3.00mm×0.6mm                      

RoHS compliant lead-free soldering compatible



 Package Outline    

Unit:mm

image008.jpgimage006.png

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NOTES:  

1. All dimensions are in millimeters;   

2. Tolerances are±0.03mm unless otherwise noted.  



●Absolute maximum ratings                                           Ta=25±3

Parameter

Symbol

Value

Unit

Power dissipation

Pd

1

W

Forward current

If

350

mA

Reverse voltage

Vr

5

V

Operating temperature range

Topr

-20~+85

Storage temperaturer range

Tstg

-40~+100

Junction Temperature

Tj

100

Pulse Forward Current

Ifp

450

mA

Electrostatic Discharge

ESD

2000(HBM)

V


●Electro-optical characteristics                                         Ta=25±3

Parameter

Test Condition

Symbol

Value

Unit

Min.

Typ.

Max.

                    Forward voltage

                    If=60 mA

                    Vf

                    2.6

                    --

                    2.9

                    V

                    Luminous intensity

                    If=60 mA

                    Φ

                    33

                    --

                    35

                    Lm

                    Viewing angle 50% Iv

                    If=60 mA

                    2θ 1/2

                    --

                    120

                    --

                    Deg

                    Reverse current

                    Vr=5V

                    Ir

                    --

                    --

                    10

                    μA

                    ColorTemperature

                    If=60 mA

                    TC

                    4000

                    --

                    4500

                    K

                    Chromaticity CIE

                    If=60 mA

                    CIE

                     

                    CRI

                    If=60 mA

                    Ra

                    ≥70

NOTES: 

1.Luminous Flux measurement tolerance:±10%

2.Forward Voltage measurement tolerance:±0.1V

3.Color Temperature measurement tolerance:x,y±0.01

4.CRI measurement tolerance:±2



 Typical optical characteristics curves 

image010.pngimage012.png

image014.pngimage016.png


image018.pngimage020.png



 Intensity Bin Limit (If=60 mA) 

Bin code

Flux(lm) for reference

Min

Max

                    1

                    33

                    35

                    2

                     

                     

                    3

                     

                     

                    4

                     

                     

                    5

                     

                     

                    6

                     

                     

                    7

                     



 VF Bin Limit (IF = 60 mA)

Bin code

Min.(V)

Max.(V)

                    1

                    2.6

                    2.7

                    2

                    2.7

                    2.8

                    3

                    2.8

                    2.9

                    4

                     

                     

                    5

                     



 Chromaticity CIE 

image025.png



 Color Bin Limit (IF = 60 mA) 

image027.png

image029.png



Requirements for application and reflow soldering

Reflow Soldering

                    Pre-heat

                    120~160℃

                    Pro-heat time

                    120 seconds Max.

                    Peak temperature

                    260℃ Max.

                    Soldering time

                    10 seconds Max.

                    Condition

                    Refer to Temperature-profile

    After reflow soldering rapid cooling should be avoided

Temperature-profile(Surface of circuit board)  

Use the following conditions shown in the figure.


                                                      <Pb-free solder> 

image031.png

    1.Reflow soldering should not be done more than two times    

2.When soldering,do not put stress on the LEDs during heating

 


Handling Precautions

Compare to epoxy encapsulation that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force. As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED product, Failure to comply might leads to damage and premature failure of the LED.

 

♦ Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or handle the silicone lens surface, it may damage the internal circuitry.

♦ Not suitable to operate in acidic environment, PH<7.

 

♦ LED operating environment and sulfur element composition cannot be over 25 PPM in the LED mating usage material.

 

When we need to use external glue for LEDs application products, please make sure that the external gluematches the LEDs packaging glue. Additionally ,as most of LEDs packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LEDs, which may cause the malfunction of LEDs, the single content of Bromine 

element is required to be less than 225 PPM,the single content of Chlorine element is required to be less than225PPM,the total content of Bromine element and Chlorine element in the external glue of the applicationproducts is required to be less than  375 PPM.

 

♦ The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top ofpackage. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should betaken to avoid the strong pressure on the encapsulated part. So when using the picking up nozzle, the pressureon the silicone resin should be proper.

 

♦ Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristicssuch as the lower forward voltage, or the not light at low current, even not light. All devices, equipment andmachinery must be properly grounded. At the same time, it is recommended that wrist bands oranti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.

 

Storage

♦ Before opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. The LEDs shouldbe used within a year.

 

♦ After opening the package, the product should be stored at 30℃ or less and humidity less than 10% RH, andbe soldered within 24 H. It is recommended that the product be operated at the workshop condition of 30℃or less and humidity less than 60% RH. If unused LEDs remain, they should be stored in moisture proofpackages, such as sealed containers with packages of moisture absorbent material (silica gel). It is alsorecommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bagagain.



●Reliability 

(1)  TEST ITEMS AND RESULTS 

                    Type

                    Test Item

                    Ref.Standard

                    Test Conditions

                    Note

                    Number of Damaged

Environmental
     Sequence

                    Resistance to Soldering Heat(Reflow Soldering)

                    JESD22-B106

                    Tsld=260℃,10sec

                    2 times

                    0/100

                    Temperature Cycle

                    JESD22-A104

                    -40℃30min ↑↓5min
     100℃ 30min

                    100 cycle

                    0/100

                    Thermal Shock

                    JESD22-A106

                    -40℃15min ↑↓5min
     100℃ 15min

                    100 cycle

                    0/100

                    High Temperature Storage

                    JESD22-A103

                    Ta=100℃

                    1000 hrs

                    0/100

                    Low Temperature Storage

                    JESD22-A119

                    Ta=-40℃

                    1000 hrs

                    0/100

                    Power temperature Cycling

                    JESD22-A105

                    On 5min -40℃>15min
     ↑↓    ↑↓<15min
     Off5min 100℃>15min

                    100 cycle

                    0/100

Operation
     Sequence

                    Life Test

                    JESD22-A108

                    Ta=25℃
     IF=150mA

                    1000 hrs

                    0/100

                    High Humidity Heat
     Life Test

                    JESD22-A101

                    80℃RH=80%
     IF=150mA

                    1000 hrs

                    0/100


    (2)  CRITERRIA FOR JUDGING THE DAMAGE

                    Item

                    Symbol

                    Test Conditions

                    Criteria for Judgement

                    Min

                    Max.

                    Forward Voltage

                    VF

                    IF=150mA

                    --

                    U.S.L*)×1.1

                    Reverse Current

                    IR

                    VR=5V

                    --

                    U.S.L*)×2.0

                    Luminous Intensity

                    IV

                    IF=150mA

                    L.S.L**)×0.7

   

                             U.S.L.:Upper Standard Level              L.S.L.:Lower Standard Level


Packaging Specifications

Package Tape Specifications:(4000 pcs/Reel)

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    Dimensions of Tape(Unit:mm)

image034.png


image036.png


Company:

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Patents:

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