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0.5W SMD 5630 LED

- Jun 06, 2018 -

Product Description

  • Model NO.: 5630-61811CP

  • Chip Material: InGaN

  • Emitting Color: White

  • LED Chips: Epistar

  • Life: 50000h

  • Chip: 14*28mil/22*30mil

  • Wire: 999 Gold Wire

  • CRI: 80

  • LED Packaging Type: Top

  • Beam Angle: 120°

  • Base Material: Copper

  • Power: 0.5W

  • Certification: RoHS

  • Lead Frame: Copper

  • Glue: Dowcorning / Intematix

  • Lumen: >50lm

  • Origin: Dongguan


Description:


. This White Colored surface-mount LED size in standard package: 5.7x3.0x0.8mm

. It has a substrate made up of a molded

. The PCT package design is ensured with high quality component materials that allow these products to perform with high reliability.



Features and Benefits:

. The outstanding physical, heat and electric properties of PCT resin

. Mid Power to High Power, up to 0.66W

. Max. Driving Current 200mA

. Compact Package Size

. High Color Quality with CRI Min. 80

. Pb-free Reflow Soldering Application

Size and Soldering Pad:


Key Applications:

. Retrofits(replacement)

. General lighting

. Indoor & Outdoor sign board back light

. Architectural / Decorative lighting



Caution:

1.Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged.

2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used.

3. Die slug is to be soldered.

4. When soldering, do not put stress on the LEDs during heating.

5. After soldering, do not warp the circuit board.


Notes on LumiS PCT Series soldering:

1.Recommend to use reflow machine.
2.Recommend to use heating plate soldering.
3.Manual soldering is not recommended.

Notes on reflow process:

1.To confirm whether the actual temperature curve in the reflow soldering conditions comply with recommended conditions. LEDs are guaranteed for one time reflow.
2.During reflow process do not apply force on LED active area.
3.After reflow process, PCB board should be cooled down before packing or storage.


Parameters:

term Min. Typ. Max. Unit Testing Current/CRI
Forword Voltage 3.0 3.1 3.3 V 150mA Ra80
FluX Lumen 50 55 60 lm
CCT 5700 6100 6500 K
Angle 120 125 130 °