●High quality warm white taiwan chip 2835 smd led 0.2w the vertical structure: Chip direct conduction fins to improve the heat dissipation performance, which can withstand the higher current (40-60mA)
●Large heat sink: larger than 3528,3014 heat sink 2-3 times, excellent heat dissipation design, light decay of LED chip life more secure
Oversized light-emitting surface: to improve the rate of light: up to 90%.
1).High quality warm white taiwan chip 2835 smd led 0.2w the vertical structure: Chip direct conduction fins to improve the heat dissipation performance, which can withstand the higher current (40-60mA)
2).Large heat sink: larger than 3528,3014 heat sink 2-3 times, excellent heat dissipation design, light decay of LED chip life more secure
3).Oversized light-emitting surface: to improve the rate of light: up to 90%.
4).Ultra-thin structure: to solve the 3528,3014 been long-standing problem spot;
5).High optical efficiency: higher than 3528,3014 luminous efficiency 2-3 times the luminous efficiency of up to 90-100LM / W;
6).Super stability: low light fades material, process, process maturity and stability.
7). The high cost: to achieve the same luminous flux, than 3528,3014 costs reduced more than 20%
●Absolute maximum ratings Ta=25±3℃
Operating temperature range
Storage temperaturer range
Pulse Forward Current
●Electro-optical characteristics Ta=25±3℃
Viewing angle 50% Iv
1.Luminous Flux measurement tolerance:±10%
2.Forward Voltage measurement tolerance:±0.1V
3.Color Temperature measurement tolerance:x,y±0.01
4.CRI measurement tolerance:±2
● Typical optical characteristics curves
● Intensity Bin Limit (IF = 60 mA)
Flux(lm) for reference
● VF Bin Limit (IF = 60 mA)
● Chromaticity CIE
● Color Bin Limit (IF = 60 mA)
●Requirements for application and reflow soldering
120 seconds Max.
10 seconds Max.
Refer to Temperature-profile
After reflow soldering rapid cooling should be avoided
Temperature-profile(Surface of circuit board)
Use the following conditions shown in the figure.
<Pb-free solder> <Lead solder>
1.Reflow soldering should not be done more than two times
2.When soldering,do not put stress on the LEDs during heating
TEST ITEMS AND RESULTS
Number of Damaged
Resistance to Soldering Heat(Reflow Soldering)
High Temperature Storage
Low Temperature Storage
Power temperature Cycling
On 5min -40℃＞15min
High Humidity Heat
(2) CRITERRIA FOR JUDGING THE DAMAGE
Criteria for Judgement
U.S.L.:Upper Standard Level L.S.L.:Lower Standard Level
Package Tape Specifications：(4000 pcs/Reel)
DHL, UPS, FEDEX, EMS, TNT, by sea, by air flight
●LED Panel light
●LED bulb light
●LED tube light
●LED strip light
●LED spot light etc.
Before opening the package:The LEDs should be kept at 5~30°C and 60%RH or less. The LEDs should be used within a year. After opening the package:The LED must be used within 24 hours, else should be kept at 5~30℃ and 30% RH or less. The LEDs should be used within 7days after opening the package. If unused LEDs remain, they should be stored in moisture proof pachages .recommend to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. If the LEDs have exceeded the storage time, baking treatment
should be performed more than 24 hours at 60 ± 5°C.
When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds
The hand solder should be done only one times
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing.
1.Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED.
2.Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry.
3.The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to
prevent air leaks. The inner diameter of the nozzle should be as large as possible. A pliable
material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during
pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.
4.Do not stack together assembled PCBs containing LEDs.Impact may scratch the silicone lens or damage the internal circuitry.
5.Not suitable to operate in acidic erivironmengt.PH<7.
Q1. Can I have a sample order for led light?
A: Yes, we welcome sample order to test and check quality. Mixed samples are acceptable.
Q2. What about the lead time?
A:Sample needs 1-3 days, mass production time needs 5-7 days for order quantity more than 100KK.
Q3. Do you have any MOQ limit for led light order?What's the Payment way ?
A: MOQ is 100pcs for each model. We accept T/T Paypal and Western Union three ways paymant
Q4. How do you ship the goods and how long does it take to arrive?
A: We usually ship by DHL, UPS, FedEx or TNT. It usually takes 2-5 days to arrive. Airline and sea shipping also optional.
Q5. How to proceed an order for led light?
A: Firstly let us know your requirements or application.
Secondly We quote according to your requirements or our suggestions.
Thirdly customer confirms the samples and places deposit for formal order.
Fourthly We arrange the production.
Q6. Is it OK to print my logo on led light product?
A: Yes. Please inform us formally before our production and confirm the design firstly based on our sample.
Q7: Do you offer guarantee for the products?
A: Yes, we offer 3 years warranty to our products.
Guangdong Elite Optoelectronic Technology Co., LTD
Contact: Carol Chen