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Led Package 2835 0.2W

● Feature
●Viewing angle:120 deg                       
●The materials of the LED dice is InGaN         
●3.50mm×2.80mm×0.7mm   
●RoHS compliant lead-free soldering compatible

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Feature

Viewing angle:120 deg                       

The materials of the LED dice is InGaN         

3.50mm×2.80mm×0.7mm                      

RoHS compliant lead-free soldering compatible 



● Package Outline

Unit:mm

image004.pngimage006.png

NOTES: 

1. All dimensions are in millimeters;  

2.Tolerances are±0.03mm unless otherwise noted.



●Absolute maximum ratings                                       Ta=25±3

Parameter  

Symbol

Value

Unit

Power   dissipation

Pd

0.2

W

Forward   current

If

60

mA

Reverse   voltage

Vr

5

V

Operating temperature range

Topr

-20~+85

Storage temperaturer range

Tstg

-40~+100

Pulse Forward Current

Ifp

180

mA

 Electrostatic Discharge

ESD

2000(HBM)

V


●Electro-optical characteristics                                    Ta=25±3

Parameter  

Test   Condition

 

Symbol

 

Value  

Unit

 



Min.

Typ.

Max.





Forward voltage

 

If=60 mA

Vf

2.6

--

2.9

V

Luminous intensity

 

If=60 mA

Φ

30

--

--

Lm

Viewing angle 50%   Iv

If=60 mA

2θ 1/2

--

120

--

Deg

Reverse current

 

Vr=5V

Ir

--

--

10

μA

ColorTemperature

 

If=60 mA

TC

--

3000

--

K

Chromaticity CIE

 

If=60 mA

CIE





CRI

 

If=60 mA

Ra

≥80




NOTES:

1.  Luminous Flux measurement tolerance:±10%

2.  Forward Voltage measurement tolerance:±0.1V

3.  Color Temperature measurement tolerance:x,y±0.01

4. CRI measurement tolerance:±2



Typical optical characteristics curves 

image008.pngimage010.png

image012.pngimage014.png

image016.pngimage018.png


● Intensity Bin Limit (IF = 60 mA) 

Bin code

     Flux(lm) for reference

Min

Max

1

30

31

2

31

32


● VF Bin Limit (IF = 60 mA)

Bin   code

Min.(V)

Max.(V)

1

2.6

2.7

2

2.7

2.8

3

2.8

2.9


Chromaticity CIE 

image023.png


● Color Bin Limit (IF = 60 mA)

image025.png

image027.png


●Requirements for application and reflow soldering

                                                    Reflow Soldering  

Pre-heat

 

120~160℃

Pro-heat time

 

120 seconds Max.

 

Peak temperature

 

245℃ Max.

 

Soldering time

 

10 seconds Max.

 

Condition

 

Refer to Temperature-profile

 

After reflow soldering rapid cooling should be avoided

Temperature-profile(Surface of circuit board) 

Use the following conditions shown in the figure.


                <Pb-free solder>                                  <Lead solder>

image029.pngimage031.png

1.Reflow soldering should not be done more than two times   

2.When soldering,do not put stress on the LEDs during heating



Handling Precautions

Compare to epoxy encapsulation that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force. As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED product, Failure to comply might leads to damage and premature failure of the LED.


♦ Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or handle the silicone lens surface, it may damage the internal circuitry.

 

♦ Not suitable to operate in acidic environment, PH<7.

 

♦ LED operating environment and sulfur element composition cannot be over 25 PPM in the LED mating usage material.

 

When we need to use external glue for LEDs application products, please make sure that the external gluematches the LEDs packaging glue. Additionally ,as most of LEDs packaging glue is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LEDs, which may cause the malfunction of LEDs, the single content of Bromine

element is required to be less than 225 PPM,the single content of Chlorine element is required to be less than225PPM,the total content of Bromine element and Chlorine element in the external glue of the applicationproducts is required to be less than  375 PPM.

 

♦ The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top ofpackage. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should betaken to avoid the strong pressure on the encapsulated part. So when using the picking up nozzle, the pressureon the silicone resin should be proper.

 

♦ Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristicssuch as the lower forward voltage, or the not light at low current, even not light. All devices, equipment andmachinery must be properly grounded. At the same time, it is recommended that wrist bands oranti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs.

 

Storage

♦ Before opening the package, the LEDs should be kept at 30℃ or less and 60%RH or less. The LEDs shouldbe used within a year.

 

♦ After opening the package, the product should be stored at 30℃ or less and humidity less than 10% RH, andbe soldered within 24 H. It is recommended that the product be operated at the workshop condition of 30℃or less and humidity less than 60% RH. If unused LEDs remain, they should be stored in moisture proofpackages, such as sealed containers with packages of moisture absorbent material (silica gel). It is alsorecommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bagagain.



●Reliability

(1)   TEST ITEMS AND RESULTS

Type

Test Item

Ref.Standard

Test Conditions

Note

Number of Damaged

Environmental
     Sequence

Resistance to    Soldering Heat(Reflow Soldering)

JESD22-B106

Tsld=260℃,5sec

2 times

0/100

Temperature Cycle

JESD22-A104

-40℃30min    ↑↓5min
     100℃    30min

100 cycle

0/100

Thermal Shock

JESD22-A106

-40℃15min    ↑↓5min
     100℃    15min

100 cycle

0/100

High Temperature    Storage

JESD22-A103

Ta=100℃

1000 hrs

0/100

Low Temperature    Storage

JESD22-A119

Ta=-40℃

1000 hrs

0/100

Power temperature    Cycling

JESD22-A105

On 5min -40℃>15min
     ↑↓    ↑↓<15min
     Off5min 100℃>15min

100 cycle

0/100

Operation
     Sequence

Life Test

JESD22-A108

Ta=25℃
     IF=150mA

1000 hrs

0/100

High Humidity Heat
     Life Test

JESD22-A101

80℃RH=80%
     IF=150mA

1000 hrs

0/100


(2)  CRITERRIA FOR JUDGING THE DAMAGE

Item

Symbol

Test    Conditions

Criteria    for Judgement

Min.

Max.

Forward    Voltage

VF

IF=150mA

--

U.S.L*)×1.1

Reverse    Current

IR

VR=5V

--

U.S.L*)×2.0

Luminous    Intensity

IV

IF=150mA

L.S.L**)×0.7

 

                         U.S.L.:Upper Standard Level              L.S.L.:Lower Standard Level



Packaging Specifications


Package Tape Specifications:(4000 pcs/Reel) 

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Dimensions of Tape(Unit:mm)

image034.png


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Company

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Patents

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